Electromigration Behavior of through-Si-via (TSV) Interconnect for 3-D Flip Chip Packaging
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概要
- 論文の詳細を見る
- 2010-05-01
著者
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JUNG Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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HA Sang-Su
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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YANG Jun-Mo
National Nanofab Center, Measurement & Analysis
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Jung Seung-boo
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Ha Sang-su
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Yang Jun-mo
National Nanofab Center Measurement & Analysis
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Yang Jun-mo
National Nanofab Center
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