Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film
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概要
- 論文の詳細を見る
This study investigates the feasibility of ultrasonic bonding of flexible printed circuit board (FPCB) on glass with nonconductive film (NCF). The glass substrate is sputtered with Cr as a diffusion barrier and Cu to form the electrodes, whereas two different surface finishes are employed for the FPCB: immersion Sn and electroless Ni/immersion Au (ENIG). The peel strengths of the joints are investigated with various parameters, such as bonding time and pressure. The study showed that bonding time of the joints was not related to the degree of curing of NCF, because almost the same curing degree resulted when bonded for 1 or 3 s. Furthermore, the bonding pressure on the joints is strongly related to the amplitude of vibration at the horn.
- 2009-07-25
著者
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Koo Ja-Myeong
Mechatronics and Manufacturing Technology Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Chun Chang-Keun
Welding Research Center, Research Institute of Industrial Science and Technology, Pohang, Gyeongbuk 790-330, Republic of Korea
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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