2-09P-48 プリント基板をフレキシブル基板間の接合強度に及ぼす溶接条件の影響(ポスターセッション 2)
スポンサーリンク
概要
- 論文の詳細を見る
The purpose of this paper is to bond electrodes between the rigid printed circuit board (RPCB) and flexible PCB (FPCB) using ultrasonic vibration. The electrodes of FPCB and RPCB were electroless-plated with Sn and electroless Ni/immersion Au (ENIG), respectively. The peel strengths of the joints were investigated with various parameters, such as bonding pressure, time and temperature. This study showed that the electrodes between the RPCB and FPCB were successfully bonded without any adhesive at a low temperature for a short low time, compared to other bonding methods: adhesive bonding and thermo-compression bonding.
- 超音波エレクトロニクスの基礎と応用に関するシンポジウム運営委員会の論文
- 2007-11-14
著者
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Koo Ja-Myeong
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Lee Jong-Bum
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung-Boo
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung‐boo
Sungkyunkwan Univ. Suwon Kor
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Moon Young‐jun
Samsung Electronics Co. Ltd. Suwon Kor
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Koo Ja-myeong
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Hong Soon-Min
Samsung Electronics Co. Ltd.
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Shin Hyoyoung
Samsung Electronics Co. Ltd.
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Moon Young-jun
Samsung Electronics Co. Ltd.
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Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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