Jung Seung‐boo | School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
スポンサーリンク
概要
関連著者
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Lee Jong-Bum
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung-Boo
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Koo Ja-Myeong
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung‐boo
Sungkyunkwan Univ. Suwon Kor
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Koo Ja-myeong
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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JUNG Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Jo Jung-Lae
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jo Jung-lae
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Moon Jeong-Hoon
Suwon Sci. College, Dept. of Mechanical Eng.
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Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Yoon Jeong-won
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Moon Jeong‐hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Koh Min-kwan
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Kim Dae-gon
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Moon Jeong-hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Jung Seung‐boo
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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YOON Jeong-Won
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Moon Young‐jun
Samsung Electronics Co. Ltd. Suwon Kor
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Koo Ja-myeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Kim Yu‐na
Sungkyunkwan Univ. Gyeonggi Kor
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Moon Won-chul
Sungkyunkwan Univ. Micro Electronic Packaging Consortium
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Kim Kyung-sik
International Display Solution Co. Ltd.
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Nam Jae-do
School Of Applied Chemistry Sungkyunkwan University
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Yoon Jae-hyun
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Koh Min-Kwan
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Hong Soon-Min
Samsung Electronics Co. Ltd.
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Shin Hyoyoung
Samsung Electronics Co. Ltd.
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Moon Young-jun
Samsung Electronics Co. Ltd.
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Kim Yu-Na
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Kim Jong-woong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Ko Min-Kwan
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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KIM Dae-Gon
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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CHOI Sunglak
AMLCD Division, Samsung Electronics Co., Ltd.
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LEE Hoo-Jeong
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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JOO Jinho
School of Advanced Materials Science & Engineering, Sungkyunkwan University
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Joo Jinho
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Choi Sunglak
Amlcd Division Samsung Electronics Co. Ltd.
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Lee Hoo-jeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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KIM Dae-Gon
Advanced Materials and Process Research Center for IT, Sungkyunkwan University
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YOON Jeong-Won
Advanced Materials and Process Research Center for IT, Sungkyunkwan University
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LEE Chang-Youl
Advanced Materials and Process Research Center for IT, Sungkyunkwan University
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JUNG Seung-Boo
Advanced Materials and Process Research Center for IT, Sungkyunkwan University
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Kim Yu-na
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Lee Hoo-jeong
School Of Advanced Material Science Sungkyunkwan University
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Lee Chang-youl
Advanced Materials And Process Research Center For It Sungkyunkwan University
著作論文
- 2P4-2 超音波によるプリント基板接合における機械特性への表面仕上げの影響(ポスターセッション)
- 1P1-11 大気圧プラズマ処理の超音波バンプボンディングにおよぼす影響(ポスターセッション)
- 1Pb-49 超音波接合されたフリップチップパッケージにおける非鉛エポキシソルダの熱特性(ポスターセッション)
- 1Pb-50 金属基板とフレキシブル基板の超音波接合特性(ポスターセッション)
- 1P1-12 フレキシブル電極パターンのガラス基板上への超音波ボンディングと諸条件の影響(ポスターセッション)
- 2-09P-48 プリント基板をフレキシブル基板間の接合強度に及ぼす溶接条件の影響(ポスターセッション 2)
- 2-09-03 超音波ボンディングされたフリップチップバンプとフレキシブル基板の接合強度への大気圧プラズマの影響(強力超音波)
- Characterization of Failure Behaviors in Anisotropic Conductive Interconnection
- Reaction Diffusion and Formation of Cu_In_9 and In_Ni_ Phases in the Couple of Indium-Substrates