Koo Ja-Myeong | Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
スポンサーリンク
概要
関連著者
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Koo Ja-Myeong
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Lee Jong-Bum
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung-Boo
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung‐boo
Sungkyunkwan Univ. Suwon Kor
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Koo Ja-myeong
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jo Jung-Lae
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jo Jung-lae
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Moon Jeong-Hoon
Suwon Sci. College, Dept. of Mechanical Eng.
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Moon Jeong‐hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Moon Jeong-hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Moon Young‐jun
Samsung Electronics Co. Ltd. Suwon Kor
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Kim Yu‐na
Sungkyunkwan Univ. Gyeonggi Kor
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Moon Won-chul
Sungkyunkwan Univ. Micro Electronic Packaging Consortium
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Lee Jong-Gun
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Hong Soon-Min
Samsung Electronics Co. Ltd.
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Shin Hyoyoung
Samsung Electronics Co. Ltd.
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Moon Young-jun
Samsung Electronics Co. Ltd.
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Kim Yu-Na
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Kim Yu-na
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
著作論文
- 1P1-11 大気圧プラズマ処理の超音波バンプボンディングにおよぼす影響(ポスターセッション)
- 1P1-12 フレキシブル電極パターンのガラス基板上への超音波ボンディングと諸条件の影響(ポスターセッション)
- 2-09P-48 プリント基板をフレキシブル基板間の接合強度に及ぼす溶接条件の影響(ポスターセッション 2)
- 2-09-03 超音波ボンディングされたフリップチップバンプとフレキシブル基板の接合強度への大気圧プラズマの影響(強力超音波)