Lee Jong-bum | School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
スポンサーリンク
概要
関連著者
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Lee Jong-Bum
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jung Seung-Boo
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Koo Ja-Myeong
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Jung Seung‐boo
Sungkyunkwan Univ. Suwon Kor
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Koo Ja-myeong
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jo Jung-Lae
Sungkyunkwan Univ. , School of Adv. Mat. Sci. & Eng.
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Jo Jung-lae
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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JUNG Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Moon Jeong-Hoon
Suwon Sci. College, Dept. of Mechanical Eng.
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Koo Ja-myeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Moon Jeong‐hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Koh Min-kwan
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Moon Jeong-hoon
Suwon Sci. College Dept. Of Mechanical Eng.
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi 440-746, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, KAIST, Daejon, 305-701 Republic of Korea
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Moon Young‐jun
Samsung Electronics Co. Ltd. Suwon Kor
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Kim Yu‐na
Sungkyunkwan Univ. Gyeonggi Kor
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Moon Won-chul
Sungkyunkwan Univ. Micro Electronic Packaging Consortium
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Yoon Jae-hyun
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Koh Min-Kwan
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Shin Young-eui
School Of Mechanical Engineering Chung-ang University
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Hong Soon-Min
Samsung Electronics Co. Ltd.
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Shin Hyoyoung
Samsung Electronics Co. Ltd.
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Moon Young-jun
Samsung Electronics Co. Ltd.
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Kim Yu-Na
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Noh Bo-in
School Of Advanced Materials Science And Engineering Sungkyunkwan University
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Jeon Sung-ho
School Of Mechanical Engineering Chung-ang University
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Kim Jong-woong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Ko Min-Kwan
Sungkyunkwan Univ., School of Adv. Mat. Sci. & Eng.
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Kim Yu-na
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jung Jae-Pil
Department of Materials Science & Engineering, University of Seoul
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Kim Jong-Min
School of Chemical Engineering & Material Science, Chung-Ang University
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Lee Jong-Gun
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Koo Ja-Myeong
Mechatronics and Manufacturing Technology Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Chun Chang-Keun
Welding Research Center, Research Institute of Industrial Science and Technology, Pohang, Gyeongbuk 790-330, Republic of Korea
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Kim Jong-Min
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi-do 440-746, Republic of Korea
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Moon Young-jun
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Koo Ja-Myeong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Koo Ja-Myeong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Kim Yu-Na
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Kim Dae-Up
Materials Research Department, Hyundai MOBIS Co., Yongin, Gyeonggi 446-912, Republic of Korea
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Hong Soon-Min
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Shin Hyoyoung
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, Republic of Korea
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Noh Bo-In
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Shin Young-Eui
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Kim Jong-Woong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi 440-746, Republic of Korea
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Jung Jae-Pil
Department of Materials Science and Engineering, The University of Seoul, Seoul 130-743, Republic of Korea
著作論文
- 2P4-2 超音波によるプリント基板接合における機械特性への表面仕上げの影響(ポスターセッション)
- 1P1-11 大気圧プラズマ処理の超音波バンプボンディングにおよぼす影響(ポスターセッション)
- 1Pb-49 超音波接合されたフリップチップパッケージにおける非鉛エポキシソルダの熱特性(ポスターセッション)
- 1Pb-50 金属基板とフレキシブル基板の超音波接合特性(ポスターセッション)
- 1P1-12 フレキシブル電極パターンのガラス基板上への超音波ボンディングと諸条件の影響(ポスターセッション)
- 2-09P-48 プリント基板をフレキシブル基板間の接合強度に及ぼす溶接条件の影響(ポスターセッション 2)
- 2-09-03 超音波ボンディングされたフリップチップバンプとフレキシブル基板の接合強度への大気圧プラズマの影響(強力超音波)
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
- Effect of Atmospheric Pressure Plasma Treatment on Transverse Ultrasonic Bonding of Gold Flip-Chip Bump on Glass Substrate
- Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film
- Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards