Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards
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概要
- 論文の詳細を見る
In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion Au (ENIG), whereas two different surface finishes are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of (CuxAu1-x)6Sn5 is formed at the ENIG/Sn interface, a Au–Ni–P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/ENIG joint. Results of peel tests show that the bonding conditions have a significant effect on joint integrity.
- 2008-05-25
著者
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Koo Ja-myeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jung Jae-Pil
Department of Materials Science & Engineering, University of Seoul
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Moon Young-jun
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Koo Ja-Myeong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Hong Soon-Min
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Shin Hyoyoung
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, KAIST, Daejon, 305-701 Republic of Korea
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Jung Jae-Pil
Department of Materials Science and Engineering, The University of Seoul, Seoul 130-743, Republic of Korea
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