Fluxless Sn-3.5mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2002-06-01
著者
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Jung J‐p
Department Of Materials Science & Engineering University Of Seoul
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Hong Soon-min
Micro-joining Lab. Institute Of Intelligent System Mechatronics Center Samsung Electronics Co. Ltd.
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Kang Choon-sik
School Of Materials Science & Engineering Seoul National University
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Jung Jae-pil
Department Of Materials Science And Engineering University Of Seoul
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Jung Jae-Pil
Department of Materials Science & Engineering, University of Seoul
関連論文
- Fluxless Sn-3.5mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave
- Fluxless Wetting Properties of Top Surface Metallurgy in Different Pb-Free Solders
- A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder
- Fluxless Wetting Properties of the UBM-Coated Si-Wafer to Pb-Free Solders under Different Atmosphere
- Reliability of Sn-8mass%Zn-3mass%Bi Lead-Free Solder and Zn Behavior
- Effect of Oxide Morphology on Bond Strength of Diffusion-Bonded Interfaces of Al-Alloys(Materials, Metallurgy & Weldability)
- Interfacial Oxide in Diffusion-Bonded Joints of Al-Binary Alloys by Transmission Electron Microscopy(Materials, Metallurgy & Weldability)
- Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards