Jung J‐p | Department Of Materials Science & Engineering University Of Seoul

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概要

• Jung Jae-Pilの詳細を見る
• 同名の論文著者
• Department Of Materials Science & Engineering University Of Seoulの論文著者

関連著者

• Jung J‐p

  Department Of Materials Science & Engineering University Of Seoul

• Hong Soon-min

  Micro-joining Lab. Institute Of Intelligent System Mechatronics Center Samsung Electronics Co. Ltd.

• Kang Choon-sik

  School Of Materials Science & Engineering Seoul National University

• Jung Jae-pil

  Department Of Materials Science And Engineering University Of Seoul

• Jung Jae-Pil

  Department of Materials Science & Engineering, University of Seoul

• MATSUDA Fukuhisa

  Osaka University

• IKEUCHI Kenji

  Osaka University

• Ikeuchi K

  Kyoto Univ. Kyoto Jpn

• Matsuda F

  Osaka University

• Ikeuchi K

  大阪大学接合科学研究所

• Jung Jae-pil

  Osaka University:university Of Seoul

• Ikeuchi Kenji

  Welding Research Institute Osaka University

• HONG Soon-Min

  School of Materials Science and Engineering, Seoul National University

• PARK Jae-Yong

  School of Materials Science and Engineering, Seoul National University

• Park Jae-yong

  School Of Materials Science And Engineering Seoul National University

• KOTANI Keiko

  Osaka University

• Matsuda Fukuhisa

  Osaka Univ.

• Kotani Keiko

  Osaka University:tokoname Ceramic Research Institute Of Aichi Prefecture

• Park Chang-bae

  Department Of Materials Science & Engineering University Of Seoul

• Shin Yong-eui

  Department Of Mechanical Engineering Chung-ang University

• HONG Soon-Min

  Scholl of Materials Science and Engineering, Seoul National University

• KANG Choon-Sik

  Scholl of Materials Science and Engineering, Seoul National University

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著作論文

• Fluxless Sn-3.5mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave
• Fluxless Wetting Properties of Top Surface Metallurgy in Different Pb-Free Solders
• A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder
• Fluxless Wetting Properties of the UBM-Coated Si-Wafer to Pb-Free Solders under Different Atmosphere
• Effect of Oxide Morphology on Bond Strength of Diffusion-Bonded Interfaces of Al-Alloys(Materials, Metallurgy & Weldability)
• Interfacial Oxide in Diffusion-Bonded Joints of Al-Binary Alloys by Transmission Electron Microscopy(Materials, Metallurgy & Weldability)

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