Jung Jae-Pil | Department of Materials Science & Engineering, University of Seoul
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概要
関連著者
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Jung Jae-Pil
Department of Materials Science & Engineering, University of Seoul
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Jung Jae-pil
Department Of Materials Science And Engineering University Of Seoul
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Jung J‐p
Department Of Materials Science & Engineering University Of Seoul
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Hong Soon-min
Micro-joining Lab. Institute Of Intelligent System Mechatronics Center Samsung Electronics Co. Ltd.
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Kang Choon-sik
School Of Materials Science & Engineering Seoul National University
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HONG Soon-Min
School of Materials Science and Engineering, Seoul National University
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PARK Jae-Yong
School of Materials Science and Engineering, Seoul National University
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Park Jae-yong
School Of Materials Science And Engineering Seoul National University
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Young-woo
Department of Internal Medicine
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Moon Young-jun
Mechatronics Center Samsung Electronics
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Park Chang-bae
Department Of Materials Science & Engineering University Of Seoul
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Lee Ji-won.
Mechatronics Center Samsung Electronics
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Koo Ja-myeong
School Of Advanced Materials Science & Engineering Sungkyunkwan University
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Lee Young-woo
Department Of Materials Science And Engineering University Of Seoul
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Lee Young-woo
Department Of Environmental And Ocean Engineering University Of Tokyo
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Cho Sun-yun
Department Of Materials Science And Engineering University Of Seoul
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Shin Yong-eui
Department Of Mechanical Engineering Chung-ang University
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Kim Kyoo-seok
Department Of Materials Science And Engineering University Of Seoul
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HONG Soon-Min
Scholl of Materials Science and Engineering, Seoul National University
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KANG Choon-Sik
Scholl of Materials Science and Engineering, Seoul National University
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HAN Hyun-Joo
Mechatronics Center, Samsung Electronics
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KIM Mi-Jin
Mechatronics Center, Samsung Electronics
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Kim Mi-jin
Mechatronics Center Samsung Electronics
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Han Hyun-joo
Mechatronics Center Samsung Electronics
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Moon Young-jun
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Koo Ja-Myeong
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea
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Hong Soon-Min
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Shin Hyoyoung
Fundamental Technology Research Team, Mechatronics and Manufacturing Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, KAIST, Daejon, 305-701 Republic of Korea
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Jung Jae-Pil
Department of Materials Science and Engineering, The University of Seoul, Seoul 130-743, Republic of Korea
著作論文
- Fluxless Sn-3.5mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave
- Fluxless Wetting Properties of Top Surface Metallurgy in Different Pb-Free Solders
- A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder
- Fluxless Wetting Properties of the UBM-Coated Si-Wafer to Pb-Free Solders under Different Atmosphere
- Reliability of Sn-8mass%Zn-3mass%Bi Lead-Free Solder and Zn Behavior
- Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards