Reliability of Sn-8mass%Zn-3mass%Bi Lead-Free Solder and Zn Behavior
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2005-11-20
著者
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Lee Young-woo
Department of Internal Medicine
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Moon Young-jun
Mechatronics Center Samsung Electronics
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Lee Ji-won.
Mechatronics Center Samsung Electronics
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Lee Young-woo
Department Of Materials Science And Engineering University Of Seoul
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Lee Young-woo
Department Of Environmental And Ocean Engineering University Of Tokyo
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Cho Sun-yun
Department Of Materials Science And Engineering University Of Seoul
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Kim Kyoo-seok
Department Of Materials Science And Engineering University Of Seoul
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Jung Jae-pil
Department Of Materials Science And Engineering University Of Seoul
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HAN Hyun-Joo
Mechatronics Center, Samsung Electronics
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KIM Mi-Jin
Mechatronics Center, Samsung Electronics
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Kim Mi-jin
Mechatronics Center Samsung Electronics
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Han Hyun-joo
Mechatronics Center Samsung Electronics
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Jung Jae-Pil
Department of Materials Science & Engineering, University of Seoul
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- Fluxless Wetting Properties of the UBM-Coated Si-Wafer to Pb-Free Solders under Different Atmosphere
- Reliability of Sn-8mass%Zn-3mass%Bi Lead-Free Solder and Zn Behavior
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