Lee Jong-Gun | School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
スポンサーリンク
概要
関連著者
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Lee Jong-bum
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-Gun
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Jung Seung-boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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JUNG Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University
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Jung Seung‐boo
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Lee Jong-bum
Sungkyunkwan Univ. School Of Adv. Mat. Sci. & Eng.
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Jo Jung-Lae
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea
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Yoon Jae-hyun
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Koh Min-Kwan
School of Adv. Mat. Sci. & Eng., Sungkyunkwan Univ.
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Shin Young-eui
School Of Mechanical Engineering Chung-ang University
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Koh Min-kwan
School Of Adv. Mat. Sci. & Eng. Sungkyunkwan Univ.
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Jeon Sung-ho
School Of Mechanical Engineering Chung-ang University
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Kim Jong-Min
School of Chemical Engineering & Material Science, Chung-Ang University
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Lee Jong-Gun
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Koo Ja-Myeong
Mechatronics and Manufacturing Technology Center, Samsung Electronics Co., Ltd., Suwon 443-742, Republic of Korea
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Chun Chang-Keun
Welding Research Center, Research Institute of Industrial Science and Technology, Pohang, Gyeongbuk 790-330, Republic of Korea
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Lee Jong-Bum
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Kim Jong-Min
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi 440-746, Republic of Korea
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Moon Jeong-Hoon
Department of Mechanical Engineering, Suwon Science College, Hwaseong, Gyeonggi-do 440-746, Republic of Korea
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Jung Seung-Boo
School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea
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Yoo Choong-Don
Department of Mechanical Engineering, KAIST, Daejon, 305-701 Republic of Korea
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Shin Young-Eui
School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea
著作論文
- 2P4-2 超音波によるプリント基板接合における機械特性への表面仕上げの影響(ポスターセッション)
- 1Pb-49 超音波接合されたフリップチップパッケージにおける非鉛エポキシソルダの熱特性(ポスターセッション)
- Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
- Effect of Time and Pressure on Ultrasonic Bonding Strength of Flexible Printed Circuit Board to Glass with Nonconductive Film