Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers

スポンサーリンク

概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2010-12-01

著者

• Kim Jong-min

  School Of Mechanical Engineering Chung-ang Univ.

• Yim Byung-seung

  School Of Mechanical Engineering Chung-ang University

• Yim Byung-seung

  School Of Mechanical Engineering Chung-ang Univ.

関連論文

• Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
• Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
• Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
• Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
• Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
• Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
• Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers
• Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
• Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
• Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers

スポンサーリンク