Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers

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Wetting Transition Characteristics on Microstructured Hydrophobic Surfaces
Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
Optical Characteristics and Nanoscale Energy Transport in Thin Film Structures Irradiated by Nanosecond-to-Femtosecond Lasers
Wave Interference Effect in Thin Film Structures under Pulsed Laser Irradiation
Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
Spectral and Angular Responses of Surface Plasmon Resonance Based on the Kretschmann Prism Configuration
Numerical Analysis of Coalescence Characteristics of Low Melting Point Alloy Fillers Using a Non-Equilibrium Phase Field Model
Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
Femtosecond Laser Pulse Train Effect on Optical Characteristics and Nonequilibrium Heat Transfer in Thin Metal Films
Stability Analysis of a Pipe Conveying Periodically Pulsating Fluid Using Finite Element Method
Three Temperature Model for Nonequilibrium Energy Transfer in Semiconductor Films Irradiated with Short Pulse Lasers
Novel Miscible Blends Composed of Poly(Methyl Methacrylate) and 2,2-Bis(3,4-Carboxyphenyl)Hexafluoropropane Dianhydride-Based Polyimides with Optical Grade Clarity
Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
Comparison of Theoretical Models of Electron-Phonon Coupling in Thin Gold Films Irradiated by Femtosecond Pulse Lasers
The Flexural and Tribological Behavior of Multi-Walled Carbon Nanotube-Reinforced Polyphenylene Sulfide Composites
Modeling on the Liquid Film Heat Transfer of Impinging Sprays on the Hot Surface
Flattening Characteristics of Ni_Cr Thermal-Sprayed Coating Layers on Preheated SCM415 Substrates
Thermal Conductivity and Interconnectivity of Hexamethylene Diisocyanate Contained Polyurethane Grafted Multiwall Carbon Nanotube/Polyurethane Nanocomposite Film
Modeling of Droplet Collision Process in Inter-Spray Impingement System
Thermal Boundary Resistance Effect on Non-Equilibrium Energy Transport in Metal-Dielectric Thin Films Heated by Femtosecond Pulse Lasers
Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers
Multi-Dimensional Liquid Crystal Alignment Effect of Polymer Wall on Vertically Aligned Liquid Crystal Cell
Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
Viewing Angle Control of a Fringe-Field Switching Cell by Electrical Tilting of Liquid Crystal
Enhancement of Electrooptical Properties of Optically Compensated Bend Cell with Pixel-Isolating Polymer Wall
Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
Effect of Flame Spray Distance on the Adhesive Characteristics of Ni-20mass%Cr Layers on SCM415 Substrates
Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers
Dynamic Behavior of Non-Newtonian Droplets Impinging on Solid Surfaces

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