CHO Minhaeng | School of Mechanical Engineering, Chung-Ang University
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概要
関連著者
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CHO Minhaeng
School of Mechanical Engineering, Chung-Ang University
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Cho Minhaeng
School Of Mechanical Engineering Chung-ang Univ.
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LEE Seong
School of Mechanical Engineering, Chung-Ang University
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Lee Seong
School Of Mechanical Engineering Chung-ang Univ.
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Lee Seong
School Of Mechanical Engineering Chung-ang University
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Lee Seong
School of Electrical Engineering, Pusan National University, Busan 609-735, Korea
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Kim Jong-min
School Of Mechanical Engineering Chung-ang Univ.
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Kim Jooheon
School Of Mechanical Engineering Chung-ang University
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Kim Jong-Min
School of Chemical Engineering & Material Science, Chung-Ang University
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LEE Jae
School of Mechanical and Aerospace Engineering and Institute of Advanced Machinery and Design, Seoul
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GWON Hyuk
School of Mechanical Engineering, Chung-Ang University
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Gwon Hyuk
School Of Mechanical Engineering Chung-ang University
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Yim Byung-seung
School Of Mechanical Engineering Chung-ang University
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Cho Minhaeng
School Of Mechanical Engineering Chung-ang University
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Han Jung-geun
Department Of Civil & Environmental Engineering Chung-ang University
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SONG Yong
School of Mechanical Engineering, Chung-Ang University
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SHIN Young-Eui
School of Mechanical Engineering, Chung-Ang University
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JEON Sung-Ho
School of Mechanical Engineering, Chung-Ang University
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Shin Young-eui
School Of Mechanical Engineering Chung-ang University
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Lee Jae
School Of Computer Science And Engineering Sungshin Women's University
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Lee Jae
School Of Mechanical Engineering Chung-ang University
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Yim Byung-seung
School Of Mechanical Engineering Chung-ang Univ.
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Jeon Sung-ho
School Of Mechanical Engineering Chung-ang University
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Kim Jooheon
School Of Chemical Engineering & Materials Sci. Chung-ang Univ.
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Lee Jae
School Of Computer Science And Engineering Seoul National University
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Kim Jooheon
School Of Chemical Engineering & Material Sci. Chung-ang Univ.
著作論文
- Wetting Transition Characteristics on Microstructured Hydrophobic Surfaces
- Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
- Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
- The Flexural and Tribological Behavior of Multi-Walled Carbon Nanotube-Reinforced Polyphenylene Sulfide Composites