Optimized Surface Pre-treatments for Cu Electroless Plating in ULSI Device Interconnection : Instrumentation, Measurement, and Fabrication Technology
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2001-12-15
著者
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Cha S
Seoul National Univ. Seoul Kor
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Kim Jae
School Of Civil Urban And Geosystem Engineering Seoul National University
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CHA Seung
School of Chemical Engineering, College of Engineering, Seoul National University
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Kim Jae
School Of Chemical Engineering College Of Engineering Seoul National University
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Kim Jae
School of Chemical and Biological Engineering, Seoul National University, Seoul 151-744, Korea
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