Reduction in Interface Trap Density of Al
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概要
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An electron cyclotron resonance (ECR) plasma post-nitridation method has been investigated for improving Al<inf>2</inf>O<inf>3</inf>/SiGe metal--oxide--semiconductor (MOS) interfaces. We evaluated the interface trap density (D_{\text{it}}) of Al/Al<inf>2</inf>O<inf>3</inf>/Si<inf>0.75</inf>Ge<inf>0.25</inf>/p-Si MOS capacitors by the conductance method, showing that D_{\text{it}} of the Al<inf>2</inf>O<inf>3</inf>/SiGe interfaces was reduced to 3\times 10^{11} cm<sup>-2</sup>eV<sup>-1</sup>at the minimum expense of equivalent oxide thickness (EOT). X-ray photoelectron spectroscopy (XPS) revealed that a SiGe--ON interfacial layer was formed between the Al<inf>2</inf>O<inf>3</inf>and SiGe layers, which improved the interfacial properties through nitrogen passivation of SiGe interfaces. As a result, a superior Al<inf>2</inf>O<inf>3</inf>/SiGe MOS interface with a 0.2 nm EOT increase can be obtained by plasma post-nitridation.
- 2013-05-25
著者
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Hata Masahiko
Sumitomo Chemical
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Takenaka Mitsuru
Department Of Electrical Engineering And Information Systems School Of Engineering The University Of
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Takagi Shinichi
Department Of Electrical Engineering And Information Systems The University Of Tokyo
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Zhang Rui
Department Of Biochemistry And Molecular Biology Fourth Military Medical University
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Zhang Rui
Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Han Jaehoon
Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Osada Takenori
Sumitomo Chemical Co., Ltd., Chuo, Tokyo 104-0033, Japan
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Hata Masahiko
Sumitomo Chemical Co., Ltd., Chuo, Tokyo 104-0033, Japan
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