J0601-4-4 デジタル画像相関法を用いたひずみ計測による,電子実装部内部の非線形応力解析精度の向上([J0601-4]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(4))

概要

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The accuracy of numerical simulations like the FEM analyses in electronic packages is not always assured because the packages contains many materials that have nonlinear behavior such as the elasto-plasto-creep of solder alloy and the viscoelasticity of plastic materials. The purpose of this study is the improvement of the non-linear analysis of thermal stress field in a flip chip (FC) package. To confirm the accuracy of the FEM analyses, we compared the strain distributions in FC packages, which were measured using the digital image correlation method (DICM), with the strain distribution obtained by the FEM analyses. According to the comparison between the FEM analyses and the DIC measurements, it is important to consider the time- temperature dependence of Poisson's ratio in the visco-elasticity of UF resin to improve of the accuracy of the FEM analyses.
2010-09-04