多重磁極マグネトロンスパッタ法により作製したCo及びCu薄膜の電磁波シールド効果

概要

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Electromagnetic wave shield characteristics were studied for Co and Cu thin films prepared by magnetron sputtering with multipolar magnetic plasma confinement (MMPC). The characteristics were measured utilizing the Kansai Electronic Industry Development Center (KEC) Method. Results show that the electric field and magnetic field shield effects depend significantly on the thickness of the Co and Cu thin films. The shielding effectiveness of 1μm-thick deposited Co films for electric and magnetic fields was 69dB and 51dB, respectively, measured at 800MHz. For Cu films, the effectiveness was 77dB and 61dB, respectively. It was demonstrated that the electromagnetic wave shield effect of Co and Cu thin films, which is dependent upon the film thickness, is the result of attenuation loss and the skin effect.
2008-05-01