Damage Formed by Si^+ Implantation in GaAs
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1994-10-15
著者
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HARA Tohru
Electrical Engineering, Hosei University
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Hara Tohru
Electrical Engineering Hosei University
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Uchitomi Naotaka
Ulsi Laboratories Toshiba Research And Development Center
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MURAKI Takeshi
Electrical Engineering, Hosei University
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TAKEDA Satoru
Electrical Engineering, Hosei University
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KITAURA Yoshiaki
ULSI Laboratories, Toshiba Research and Development Center
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GAO Guang-bo
University of Illinois, Coordinated Science Laboratory
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Takeda Satoru
Electrical Engineering Hosei University
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Kitaura Yoshiaki
Ulsi Laboratories Toshiba Research And Development Center
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Gao Guang-bo
University Of Illinois Coordinated Science Laboratory
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Muraki Takeshi
Electrical Engineering Hosei University
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UCHITOMI Naotaka
ULSI Laboratories, Toshiba Research and Development Center
関連論文
- Reflow of PSG Layers by Halogen Lamp Short Duration Heating Technique
- Low Resistance Al/Si Ohmic Contacts on Boron Implanted Shallow p^+ Si Layers Formed by Halogen Lamp Annealing
- Contact Resistance of Al/Si Ohmic Electrodes Formed by Rapid Lamp Sintering.
- Damage Formed by Si^+ Implantation in GaAs
- Rapid Heating Reflow of Phosphosilicate Glass Enhanced by As Ion Implantation
- Barrier Effects of Tungsten Infer-Layer for Aluminum Diffusion in Aluminum/Silicon Ohmic-Contact System
- Properties of Titanium Layers Deposited by Collimation Sputtering
- Gate Current Control Method by Pull-Down FET's for 0-28dB GaAs Variable Attenuator in Direct-Conversion Modulator IC for 1.9GHz PHS (Special Issue on Microwave and Millimeterwave High-power Devices)
- A Buried-Channel WN_x/W Self-Aligned GaAs MESFET with High Power-Efficiency and Low Noise-Figure for Single-Chip Front-End MMIC in Personal Handy Phone System
- Buried-Channel WN_x/W Self-Aligned GaAs MESFET Process with Selectively Implanted Channel and Undoped Epitaxial Surface Layers for MMIC Applications
- Scatterings of Shallow Threshold Voltage on Si-Implanted WN Self-Alignment Gate GaAs Metal-Semiconductor Field-Effect Transistors on Different Composition 2-Inch Substrates by Growing in Three Kinds of Furnaces
- Mobility Profiles in Self-Aligned WN_X Undoped AlGaAs/n-GaAs/Undoped AlGaAs Doped-Channel Hetero-MISFETs
- Mobility Profiles in Submicron WN_x-BPLDD-GaAs MESFETs
- Stress in Al-Sc Interconnection Layers
- Silicidation Reaction and Stress in Ti/Si
- Formation of Titanium Nitride/Titanium Silicide by High Pressure Nitridation in Titanium/Silicon
- Properties of Titanium Nitride Films for Barrier Metal in Aluminum Ohmic Contact Systems
- Damage Formed on Silicon Surface by Helicon Wave Plasma Etching
- Barrier Properties for Oxygen Diffusion in a TaSiN Layer
- Damage Induced by Electron Cyclotron Resonance Plasma Etching on Silicon Surface
- Dose and Damage Measurements in Low Dose Ion Implantation in Silicon by Photo-Acoustic Displacement and Minority Carrier Lifetime
- Measurement of the Delamination of Thin Silicon and Silicon Carbide Layers by the Multi-Wavelength Laser Ellipsometer
- Carbon Ion Implantation in GaAs
- Thermal Stability in Al/Ti/GaAs Schottky Barrier
- Damage Formed by Plasma Boron Doping in Silicon
- Thermal Stability and Interfacial Reaction of Barrier Layers with Low-Dielectric-Constant Fluorinated Carbon Interlayer
- Interfacial Reaction in Polycide MOS Gate Structure Employing CVD Tungsten Silicide
- Capless Rapid Thermal Annealing of Silicon Ion Implanted Gallium Arsenide
- Resistivity of Thin Copper Interconnection Layers
- Damage Depth Profiles in Jon-Implanted Silicon by the Photoacoustic Displacement Technique