Measurement of the Delamination of Thin Silicon and Silicon Carbide Layers by the Multi-Wavelength Laser Ellipsometer
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概要
- 論文の詳細を見る
The refractive index and thickness of a triple layer are measured using a multi-wavelength laser ellipsometer, where three different wavelengths around 750 nm were empolyed. This measurement gives the refractive indexes and thickness of the delaminated Si layer and the air gap. The thickness of the delaminated Si layer and air gap are 774 nm and 60 nm, respectively, in the H^+ implanted Si layer with annealing at 600℃. The delamination of the 619-nm-thick SiC layer can also be observed by this measurement in 6H SiC, where H^+ is implanted at 100 keV with 1×10^<17> ions/cm^2 and annealing is performed at 800℃ for 10 min. This nondestructive ellipsometric measurement is useful for the delamination study of Si and SiC layers.
- 社団法人応用物理学会の論文
- 1997-09-15
著者
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HARA Tohru
Electrical Engineering, Hosei University
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Hara Tohru
Electrical Engineering Hosei University
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KAJIYAMA Kenji
Ion Engineering Research Institute Corporation
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YONEDA Tomoaki
Ion Engineering Research Institute Corporation
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Inoue Morio
Ion Engineering Research Institute Corporation
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KAKIZAKI Yasuo
Electrical Engineering, Hosei University
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TANAKA Hisao
Electrical Engineering, Hosei University
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MASANO Katsuya
Heureka Co.
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Kajiyama Kenji
Ion Engineering Research Institute Co.
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Kakizaki Yasuo
Electrical Engineering Hosei University
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Tanaka Hisao
Electrical Engineering Hosei University
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Kajiyama Kenji
Ion Engineering Research Institute
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