The Removal of Intentionally Contaminated Cu Impurities on Si Substrate Using Remote H-plasma Treatments

スポンサーリンク

概要

• 論文の詳細を見る
• 社団法人応用物理学会の論文
• 1997-09-15

著者

• LEE Chongmu

  Department of Materials Science and Engineering, Inha University

• PARK Jong-Wan

  Department of Physics, Chungbuk National University

• Lee Chongmu

  Department Of Materiais Science And Engineering Inha University

• Lee Chongmu

  Department Of Metallurgical Engineering Inha University

• JEON Hyeongtag

  Department of Materials Science and Engineering, Hanyang University

• Park Jong-wan

  Department Of Metallugical Engineering Hanyang University

• Jeon Hyeongtag

  Department Of Metallurgical Engineering Hanyang University

• AHN Taehang

  Department of Metallurgical Engineering, Hanyang University

• PARK Myounggu

  Department of Metallurgical Engineering, Inha University

• Ahn Taehang

  Department Of Metallurgical Engineering Hanyang University

• Park Myounggu

  Department Of Metallurgical Engineering Inha University

• PARK Jong-Wan

  Department of Biomedical Sciences, Seoul National University, College of Medicine

関連論文

• Influence of the aluminum and indium concentrations on the electrical resistivity and transmittance properties of InAlZnO thin films
• Influence of the anodization process conditions and the microstructure on the photothermal effect of porous silicon used as a therapeutic agent in cancer thermotherapy
• Memory Effect in an Aluminum Single-Electron Floating-Node Memory Cell
• Physical Properties of Highly Conformal TiN Thin films Grown by Atomic Layer Deposition
• Reactive oxygen species-mediated cyclin D1 degradation mediates tumor growth retardation in hypoxia, independently of p21^ and hypoxia-inducible factor
• Influence of the annealing atmosphere on the photoluminescence of ZnSe-core/In2O3-shell nanowires
• Diffusion Barrier Property of Molybdenum Nitride Films for Copper Metallization
• Surfactant Effect on Oxide-to-Nitride Removal Selectivity of Nano-abrasive Ceria Slurry for Chemical Mechanical Polishing
• The Nanotopography Effect of Improved Single-Side-Polished Wafer on Oxide Chemical Mechanical Polishing : Semiconductors
• The Effects of Pretreatment, CH_4 Gas Ratio and Bias Potential on the Microstructure of Microwave Plasma Enhanced Chemical Vapor Deposited Diamond Thin Films
• N_2^+ Implantation Approaches for Improving Thermal Stability of Cu/Mo/Si Contact Structure
• Curcumin attenuates cytochrome P450 induction in response to 2,3,7,8-tetrachlorodibenzo-p-dioxin by ROS-dependently degrading AhR and ARNT
• Effects of Chemical Interaction between Ta and SiOF on the Crystallinity of Cu and Ta in Cu/Ta/SiOF Films
• Hypoxia-Inducible Factor 1-Related Diseases and Prospective Therapeutic Tools
• Effects of Rapid Thermal Annealing after Plasma H_2 Pretreatment of the Copper Seed Layer Surface on Copper Electroplating : Semiconductors
• Effects of Post-Deposition Annealing on the Copper Films Electrodeposited on the ECR Plasma Cleaned Copper Seed Layer
• Effect of Post Plasma Treatment on Reliability of Electron Cyclotron Resonance Chemical Vapor Deposited SiOF Films
• Effects of Etch-Induced Damage and Contamination on the Physical and Electrical Properties of Cobalt Silicides
• Cardiac Hypertrophy, Abnormal Calcium Handling and Bradycardia and in Transgenic Mice Overexpressing Juntin
• Nuclear factor-κB dependency of doxorubicin sensitivity in gastric cancer cells is determined by manganese superoxide dismutase expression
• The Removal of Intentionally Contaminated Cu Impurities on Si Substrate Using Remote H-plasma Treatments
• Chemical Vapor Deposition of TiN Films from Tetrakis(ethylmethylamido)titanium and Ammonia
• Suppression by Fucoidan of Liver Fibrogenesis via the TGF-β/Smad Pathway in Protecting against Oxidative Stress
• Enhancement of Ru Nucleation in Ru-Metal Organic Chemical Vapor Deposition by Electron Cyclotron Resonance Plasma Pretreatment
• Amorphous Indium Gallium Zinc Oxide Semiconductor Thin Film Transistors Using O2 Plasma Treatment on the SiNx Gate Insulator
• Application of DC Magnetron Sputtering to Deposition of InGaZnO Films for Thin Film Transistor Devices
• Suppression by Fucoidan of Liver Fibrogenesis via the TGF-β/Smad Pathway in Protecting against Oxidative Stress
• Titanium Oxide Thin Films Prepared by Plasma Enhanced Atomic Layer Deposition Using Remote Electron Cyclotron Resonance Plasma for Organic Devices Passivation
• Amorphous Titanium Silicide Phase Formation by Surface Microroughness on Si(100)
• Effects of Process Parameters on the Deposition Rate, Hardness, and Corrosion Resistance of Tungsten Carbide Coatings Deposited by Reactive Sputtering
• Red ginseng deregulates hypoxia-induced genes by dissociating the HIF-1 dimer
• Characteristics of Metal–Oxide–Semiconductor Field-Effect Transistors with HfO2/SiO2/Si and HfO2/SiOxNy/Si Stack Structures Formed by Remote Plasma Technique
• Thermal Stability Enhancement of Cu Interconnects by Employing a Self-aligned MgO Layer Obtained From a Cu(Mg) Alloy Film
• Red ginseng and 20(S)-Rg3 control testosterone-induced prostate hyperplasia by deregulating androgen receptor signaling
• Physical Properties of Highly Conformal TiN Thin films Grown by Atomic Layer Deposition
• The Effects of Pretreatment, CH4 Gas Ratio and Bias Potential on the Microstructure of Microwave Plasma Enhanced Chemical Vapor Deposited Diamond Thin Films
• N2+ Implantation Approaches for Improving Thermal Stability of Cu/Mo/Si Contact Structure

もっと見る 閉じる

スポンサーリンク