Effects of Process Parameters on the Deposition Rate, Hardness, and Corrosion Resistance of Tungsten Carbide Coatings Deposited by Reactive Sputtering
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概要
- 論文の詳細を見る
The reactive sputter deposition of tungsten carbide (WCx) films as an alternative to chromium electroplating was studied. The effects of rf power, pressure, sputtering gas composition, and substrate temperature on the deposition rate of the WCx coatings were investigated. The effects of rf power and sputtering gas composition on the hardness and corrosion resistance of the WCx coatings were also investigated. X-ray diffraction (XRD) and Auger electron spectroscopy (AES) analyses were performed to determine the structures and compositions of the films, respectively. The hardnesses of the films were measured using a nanoindenter. The microstructures of the films were observed by scanning electron microscopy. The corrosion resistances of the films were evaluated using a salt-spray test. The deposition rate of the films was proportional to rf power and inversely proportional to the CH4 content of the sputtering gas. The deposition rate increased linearly with increasing chamber pressure. The hardness of the WCx coatings increased as rf power increased. The highest hardness was obtained at a CH4 concentration of 10 vol.% in the sputtering gas. The hardness of the WCx film deposited under optimal conditions was much higher than that of the electroplated chromium film, although the corrosion resistance of the former was slightly lower than that of the latter.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2005-05-15
著者
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Lee Chongmu
Department Of Materiais Science And Engineering Inha University
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Lim Jongmin
Department Of Materials Science And Engineering Inha University
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Park Yunkyu
Department of Materials Science and Engineering, Inha University, 253 Yonghyeon-dong, Incheon 402 75
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Park Yunkyu
Department Of Materials Science And Engineering Inha University
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