Effects of Rapid Thermal Annealing after Plasma H_2 Pretreatment of the Copper Seed Layer Surface on Copper Electroplating : Semiconductors
スポンサーリンク
概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2001-09-15
著者
-
LEE Chongmu
Department of Materials Science and Engineering, Inha University
-
Lee Hanseung
Department Of Materials Science And Engineering Inha University
-
Lee Hanseung
Department Of Materiais Science And Engineering Inha University
-
Lee Chongmu
Department Of Materiais Science And Engineering Inha University
-
OH Junhwan
Department of Materiais Science and Engineering, Inha University
-
PAUL Avijit
Department of Materiais Science and Engineering, Inha University
-
Oh Junhwan
Department Of Materiais Science And Engineering Inha University
-
Paul Avijit
Department Of Materiais Science And Engineering Inha University
関連論文
- Influence of the aluminum and indium concentrations on the electrical resistivity and transmittance properties of InAlZnO thin films
- Influence of the anodization process conditions and the microstructure on the photothermal effect of porous silicon used as a therapeutic agent in cancer thermotherapy
- Physical Properties of Highly Conformal TiN Thin films Grown by Atomic Layer Deposition
- Influence of the annealing atmosphere on the photoluminescence of ZnSe-core/In2O3-shell nanowires
- Effects of Rapid Thermal Annealing after Plasma H_2 Pretreatment of the Copper Seed Layer Surface on Copper Electroplating : Semiconductors
- Effects of Post-Deposition Annealing on the Copper Films Electrodeposited on the ECR Plasma Cleaned Copper Seed Layer
- The Removal of Intentionally Contaminated Cu Impurities on Si Substrate Using Remote H-plasma Treatments
- Chemical Vapor Deposition of TiN Films from Tetrakis(ethylmethylamido)titanium and Ammonia
- Suppression by Fucoidan of Liver Fibrogenesis via the TGF-β/Smad Pathway in Protecting against Oxidative Stress
- Enhancement of Ru Nucleation in Ru-Metal Organic Chemical Vapor Deposition by Electron Cyclotron Resonance Plasma Pretreatment
- Suppression by Fucoidan of Liver Fibrogenesis via the TGF-β/Smad Pathway in Protecting against Oxidative Stress
- Effects of Process Parameters on the Deposition Rate, Hardness, and Corrosion Resistance of Tungsten Carbide Coatings Deposited by Reactive Sputtering
- Thermal Stability Enhancement of Cu Interconnects by Employing a Self-aligned MgO Layer Obtained From a Cu(Mg) Alloy Film
- Physical Properties of Highly Conformal TiN Thin films Grown by Atomic Layer Deposition