Effects of the Annealing in Ar and H_2/Ar Ambients on the Microstructure and the Electrical Resistivity of the Copper Film Prepared by Chemical Vapor Deposition
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1996-11-15
著者
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Lee Seung-yun
Department Of Anesthesiology And Pain Medicine Konkuk University Hospital
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Lee S‐y
Yonsei Univ. Seoul Kor
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Kim D‐w
Massachusetts Inst. Technol. Ma Usa
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KIM Dong-Won
Department of Electrical Engineering and Institute for Nano Science, Korea University
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Lee W‐j
Sejong Univ. Seoul Kor
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Kim D‐w
Sun Moon Univ. Chung‐nam Kor
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Kim Dong-won
School Of Mechanical Engineering Sungkyunkwan University
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Kim Dong-won
Department Of Advanced Materials Engineering Kyonggi University
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RHA Sa-Kyun
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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PARK Chong-Ook
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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LEE Won-Jun
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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CHUN Soung-Soon
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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Chun S‐s
Korea Advanced Inst. Sci. And Technol. Taejon Kor
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Chun Soung-soon
Department Of Materials Science And Engineering Kaist
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Lee W‐j
Department Of Advanced Materials Engineering Sejong University
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Park Chong-ook
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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Rha S‐k
Department Of Materials Engineering Hanbat National University
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Rha Sa-kyun
Department Of Materials Engineering Hanbat National University
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Lee Won-jun
Department Of Advanced Materials Engineering Sejong University
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Park Chong-ook
Department Of Materials Science And Engineering Kaist
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