Effect of Underlayer on the Via Filling and the Microstructure of the Aluminum Film in Aluminum Plug Process

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概要

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• The effects of the underlayer on the via filling and the microstructure of the chemical vapor deposition (CVD)-physical vapor deposition (PVD) Al films were investigated. Three types of underlayers were examined in this work: the Ti film deposited by the ionized PVD (I-PVD) method, the metalorganic CVD (MOCVD) TiN film stacked on the I-PVD Ti film, and the PVD Al film deposited on the I-PVD Ti film. Excellent via filling was achieved by employing the MOCVD TiN/I-PVD Ti or the PVD Al/I-PVD Ti as an underlayer. When only I-PVD Ti film was used as an underlayer, complete via filling was not obtained, because the CVD Al film sealed the top of vias. The CVD-PVD Al film deposited on the PVD Al/I-PVD Ti underlayer also showed excellent crystallographic texture of Al $\langle 111\rangle$ and surface morphology, which is superior to those of the CVD-PVD Al film deposited on the MOCVD TiN/I-PVD Ti underlayer.

• Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
• 2003-06-15

著者

• Rha Sa-kyun

  Department Of Materials Engineering Hanbat National University

• Lee Won-jun

  Department Of Advanced Materials Engineering Sejong University

• Lee Won-Jun

  Department of Advanced Materials Engineering, Sejong University, 98 Gunja-dong, Gwangjin-gu, Seoul, 143-747, Korea

• Rha Sa-Kyun

  Department of Materials Engineering, Hanbat National University, San 16-1, Deongmyeong-dong, Yuseong-gu, Daejeon, 305-719, Korea

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