Effect of Underlayer on the Via Filling and the Microstructure of the Aluminum Film in Aluminum Plug Process
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-06-15
著者
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RHA Sa-Kyun
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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LEE Won-Jun
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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Rha Sa-kyun
Department Of Materials Engineering Hanbat National University
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- Effects of the Annealing in Ar and H_2/Ar Ambients on the Microstructure and the Electrical Resistivity of the Copper Film Prepared by Chemical Vapor Deposition
- Effect of Underlayer on the Via Filling and the Microstructure of the Aluminum Film in Aluminum Plug Process
- Atomic Layer Deposition and Properties of Silicon Oxide Thin Films Using Alternating Exposures to SiH2Cl2 and O3
- Characteristics of Silicon Dioxide Film Deposited by Neutral Beam-Assisted Chemical Vapor Deposition
- Thermally Stable Tungsten Bit-line Process Flow for the Capacitor Over Bit-line-Type Dynamic Random-Access Memory
- Thermally Stable Tungsten Bit-line Process Flow for the Capacitor Over Bit-line-Type Dynamic Random-Access Memory
- Study of Si3N4/SiO2/Si and SiO2/Si3N4/Si Multilayers by O and N K-Edge X-ray Absorption Spectroscopy
- Effect of Underlayer on the Via Filling and the Microstructure of the Aluminum Film in Aluminum Plug Process