塑性・クリープ分離法の鉛フリーはんだへの適用

概要

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To select the best solder alloy for the electronic packaging, a constitutive model which can be applied to alternative solder alloys is needed for the reliability evaluation such as estimations of fatigue failure using FEM analysis. In this paper, to apply the plasticity-creep separate method using the constitutive model proposed by authors to the three solder alloys such as Sn-3.5 Ag-0.75 Cu, Sn-7.5 Zn-3.0 Bi and Sn-57 Bi-1.0 Ag, the basic experiments and numerical simulations are conducted. Pure tensile tests are conducted to determine material constants of the constitutive model using the plasticity-creep separate method. The material constants determined from the only pure tensile data are used for the simulation of creep and cyclic tension-compression loading. As a result, the plasticity-creep separate method can be applied to lead-free solder alloys as well as lead solder alloys, and the simulations of the both creep and cyclic loading are successfully conducted using the material constants determined from the pure tension.
社団法人日本機械学会の論文
2003-06-25