K-0828 はんだ接続部の数値解析における弾・塑性・クリープひずみ分離法(G03-11 クリープ疲労)(G03 材料力学部門一般講演)

概要

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For the elastic-plastic-creep finite element analysis of solder joints in electronic devises, the determination of the material parameters used in the analysis is very difficult because the solder alloy shows the large time dependent deformation. In this study, a simple method to determine the material parameters is proposed with dividing the deformation into the time dependent and time independent parts. First, the material parameters for creep deformation are determined by pure tensile tests under several strain rates, and the creep deformation is calculated. Subtracting the calculated creep deformation from the pure tensile deformation, the stress-strain relation for the time independent parts is obtained. Then, the material parameters for the time independent parts such as elastic and plastic deformation are easily determined from the stress-strain relations removed the creep deformation.
社団法人日本機械学会の論文
2001-08-22