1055 Sn-3.0Ag-0.5Cu材の低サイクル疲労過程におけるクリープひずみ成分の定量化(J12-5 金属材料の疲労特性と破壊機構(5) 低サイクル疲労/超高サイクル疲労,ジョイントセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

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Solder joints in electronic package must employ lead-free solder alloys for environmental concerns. Since the solder joints are often subjected to cyclic loadings, the lead-free solder alloys must have enough fatigue strength. Therefore, the fatigue characteristics of the lead-free solder alloys must be investigated by conducting fatigue tests. Especially, the tests should be conducted considering the strain rate effect on the fatigue life because the deformation of solder alloys always shows remarkable time dependency due to creep deformation under ordinary circumstances. In this study, the fatigue tests using Sn-3.0Ag-0.5Cu lead-free solder were conducted by the cyclic tension-compression loadings whose strain rates were different in each loading direction. The creep strains in the hysteresis loop caused by the cyclic loading were estimated by conducting the cyclic stepped ramp loading test. Also the relationship between the estimated creep strain and the fatigue life was discussed.
社団法人日本機械学会の論文
2008-08-02