60Sn-40Pbはんだ材の雰囲気温度依存性とクリープ変形の記述

概要

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In this paper, we show the temperature effect on the deformation of 60 Sn-40 Pb solder alloys and its simulation using constitutive model for viscoplasticity. First, we investigate the temperature effect on the deformation of 60 Sn-40 Pb solder alloys from a series of tests, such as creep, pure tension and cyclic tension-compression loading tests. The larger temperature dependence of the solder alloys is found out. Applicability of the constitutive model that has been proposed previously to the temperature dependence of the solder alloys is verified. As a result, the parameters used in the model can be easily determined from the pure tension and the cyclic tension-compression loading test at several temperatures. It also can be found that the constitutive model can describe not only the temperature effect on the pure tension and the cyclic tension-compression loading but also the creep curves after preloading of cyclic tension-compression loading.
社団法人日本機械学会の論文
1999-08-25