J0601-4-2 Sn/Cu金属間化合物層を有するミニチュア鉛フリーはんだ試験片の引張変形特性([J0601-4]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(4))

概要

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In the design of electronic package, the FEM analysis for evaluating the strength reliability of solder joint should be conducted considering the existence of Sn/Cu intermetallic compound (IMC) generated in boundary between solder and Cu substrate. To conduct such an analysis accurately, the deformation characteristics of Sn/Cu IMC must be clarified by conducting tensile tests. In this study, we propose a method which estimates the deformation characteristics of Sn/Cu IMC subjected to tensile loading. The method employed 3 kinds of cylindrical miniature specimens whose test parts had a diameter of 0.5 mm and a gauge length of 2 mm. The first specimen was made of lead-free solder, the second was made by electrodeposition of Cu on the first specimen, and the third was made by heat treatment of the second specimen to generate Sn/Cu IMC layer. Tensile tests using these specimens were conducted and stress-strain curves obtained by the tests were compared to investigate deformation characteristics of Sn/Cu IMC.
2010-09-04