3558 階段波負荷による鉛フリーはんだの弾・塑性・クリープ特性評価(S23-2 弾性・塑性・粘塑性特性,S23 電子実装用はんだの強度特性評価)

概要

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To apply the lead-free solder alloys to the electronic equipment, the strength reliability of the lead-free solder joint must be evaluated by the accurate FEM analysis. Since the deformation behavior of lead-free solder alloys shows the time dependency, the FEM analysis often employs the constitutive models of the elasto-plastic-creep type. To conduct the high-accuracy analysis by using the constitutive model, the characteristics of the elastic, plastic and creep deformations of lead-free solder alloys should be evaluated accurately. Moreover, the evaluation should be conducted immediately because taking a long time for the evaluation delays the practical use of the lead-free solder alloys in the electronic equipment. In this study, we propose a method which can evaluate the characteristics of the elastic, plastic and creep deformations of lead-free solder alloys by conducting only one 1 test. The test was conducted under the stepped ramp wave loading which consists of the instantaneous straining parts and maintaining strain parts using Sn-3.OAg-0.5Cu lead-free solder alloys. The stress-strain relations at the instantaneous straining parts in the test are used for evaluating the elasto-plastic deformation, while the stress-time relations during the maintaining strain parts are used for evaluating the creep deformation.
社団法人日本機械学会の論文
2006-09-15