OS0320 はんだの結晶方位を考慮した実装基板熱変形解析(非立方晶型金属材料の変形現象とそのモデル化,オーガナイズドセッション)

概要

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For downsizing of electronic devices, flip-chip bonding method using BOA (Ball Grid Array) solder joints is widely used. It is known that there are a few crystal grains in a solder ball made of Sn-3Ag-0.5Cu, and therefore, grain orientations of BOA solder balls affect thennal defonnation of electronic packaging. In this paper, the fmite element method of the crystal plasticity is used to clarify the difference in the deformation of the solder balls due to the crystal orientations. As a result, the effect of the crystal orientations of grains on the defonriation is clarified. Moreover, bending deformation is simulated by structural analyses of electronic packaging considering the crystal orientation of the solder balls.
2009-07-24