J0601-5-2 はんだ結晶方位の電子実装基板熱変形への影響([J0601-5]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(5))

概要

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For downsizing of electronic devices, flip-chip bonding method using BGA (Ball Grid Array) solder joints is widely used. It is known that there are a few crystal grains in a solder ball made of Sn-3Ag- 0.5Cu, and therefore, grain orientations of BGA solder balls affect thermal deformation of electronic packaging. In this paper, the finite element method of the crystal plasticity is used to clarify the difference in the deformation of the solder balls due to the crystal orientations. As a result, the effect of the crystal orientations of grains on the deformation is clarified. Moreover, bending deformation is simulated by structural analyses of electronic packaging considering the crystal orientation of the solder balls.
2010-09-04