OS0520 電解めっき銅箔のラチェット変形とクリープ構成モデル(微視構造を有する材料の変形と破壊,オーガナイズドセッション)

概要

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Since the high-density electronic package employs electroplating copper foils for micro wiring, the characteristics of deformation of electroplating copper foils must be clarified to ensure the reliability of the micro wiring technique. Therefore, the authors have investigated them and it became clear that copper foils show time-dependent deformations, such as strain rate effect, creep, stress relaxation and ratchetting deformation. In these time-dependent deformations, the ratchetting deformation has a possibility to cause fatigue failure due to the accumulation of strain. Then, a constitutive model which can describe the ratchetting deformation of electroplating copper foils must be constructed to design electronic equipments with high-reliability. Especially, since tfie ratchetting deformation is caused by the creep deformation, the creep constitutive model for electroplating copper foils should have high accuracy. In this study, the characteristics of ratchetting deformation of an electroplating copper foil were investigated by conducting cyclic tension-unloading tests under several conditions. Also the micro structures of the specimens after the tests were examined by conducting EBSD analyses to discuss the causes of the ratchetting deformation characteristics. Based on these results, the principle for constructing a creep constitutive model was discussed.
一般社団法人日本機械学会の論文
2009-07-24