3555 鉛フリーはんだの疲労特性と応力シミュレーション(S23-1 疲労特性,S23 電子実装用はんだの強度特性評価)

概要

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The fatigue and tensile tests were conducted for some lead-free solders (Sn-3Ag-0.5Cu, Sn-9Zn and Sn-8Zn-3Bi) and two types of lead-containing solder (Sn-37Pb, Sn-95Pb) at three temperatures (233K, 298K and 398K). It was found that the relationship between the maximum stress in these fatigue tests and the test temperatures normalized by each melting point are divided roughly into 3 groups. Moreover, for lead-free solders, we proposed a visco-plastic constitutive equation, whose total strain was calculated from the sum of the elastic strain, the plastic strain, and the creep strain. The constitutive equation was incorporated to the finite element method analysis software ANSYS. The simulation result using ANSYS was highly consistent with a result of the fatigue test of Sn-3Ag-0.5Cu solder.
2006-09-15