塑性・クリープ分離によるPb/Snはんだの弾・塑性・クリープシミュレーション

概要

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For the accurate finite element analysis of solder joints in electronic packaging, a constitutive model which can describe the large time dependent deformation has been required. The requirement is not only the proposal of such a constitutive model but also the establishment of the determination method for the material parameters used in the model. In this study, we discussed on the constitutive model for solder alloys and the determination method of the material parameters for the model. First, the constitutive model that can divide the inelastic deformation into the plastic and creep parts is proposed. Next, we show the numerical method for the determination of the material parameter used in the model. In this method, the material parameters for creep part are determined firstly by pure tensile tests under several strain rates, and the creep strain is calculated. Subtracting the calculated creep strain from the pure tensile deformation, the stress-strain relation for the time independent parts is obtained. Then, the material parameters for the time independent parts such as elastic and plastic deformation are easily determined from the obtained stress-strain relations. The simulations of the stress relaxation after several different preloading are carried out to verify the applicability of the proposed model and numerical method.
社団法人日本機械学会の論文
2002-09-25