60Sn-40Pbはんだ材の粘塑性変形 : ひずみ速度効果の記述

概要

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In this paper, we discuss the viscoplastic deformation and the constitutive model of 60Sn-40Pb solder alloys which is used for the connection of electronic packaging. The constitutive model is developed with the concept that the deformation includes the elastic, plastic, and creep deformation. which is caused from the strain rate effect on the deformation of the solder alloys. Namely, the constitutive model proposed in this paper combines the cyclic plastic model for the time independent part of deformation with the Norton's creep one for the time dependent part. The applicability of the model is verified from the comparison of the simulations based on the model for a series of tests, such as a pure tension and a cyclic loading under several strain rates. As a result, the constitutive model can predict the essential futures of the time dependent deformation of 60Sn-40Pb solder alloys.
一般社団法人日本機械学会の論文
1997-05-25