無電解Ni-PめっきとSn-Ag系ははんだの継手強度と接合界面構造におよぼす各添加元素の影響

概要

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The joint strength and the joint interfaces between electroless Ni-P plating and Sn-Ag solders , as replacement solders for the eutectic Sn-37 Pb, were investigated. The joint strength between Cu plated by electroless Ni-P and Sn-3. 5 Ag and Sn-3. 5 Ag- (8, 9, 10) In decreased after annealing at 373 K, 398 K and 423 K. The effect of Zn addition to Sn-3. 5 Ag and Sn-3. 5 Ag-8 In on the joint strength and thickness of reaction layers was investigated. The joint strength of as-joined interfaces between Sn-3. 5 Ag and Sn-3. 5 Ag-8 In and electroless Ni-P plating increased by 1% Zn addition and decrease of the joint strength was inhibited by 1% Zn addition after annealing. The joint interface between Sn-Ag solders and electroless Ni-P plating consists of Ni_x-Sn_y and P-rich reaction layers. It was found that the decrease of the joint strength relates to the growth of these reaction layers. The growth of these reaction layers is inhibited by 1% Zn addition.
社団法人溶接学会の論文
2003-02-05