Hexagonal Truncated Pyramidal Light Emitting Diodes through Wafer Bonding of ZnO to GaN, Laser Lift-off, and Photo Chemical Etching
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概要
- 論文の詳細を見る
We report on a hexagonal pyramidal light emitting diodes (LEDs) produced by direct wafer bonding of a metal organic chemical vapor deposition (MOCVD) grown GaN LED on sapphire to a n-type ZnO wafer, laser lift off, and photochemical etching of the nitrogen face of the GaN LED. Laser lift off was used to remove the sapphire of the GaN wafer, exposing the Nitrogen face for roughening, in the form of microcones, as well as allowing deposition of metal contacts to the nitrogen face of the GaN LED. Contacts to the ZnO allow for the creation of a vertical current path. Selective etching was used to form truncated hexagonal pyramids of the ZnO.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2008-05-25
著者
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Denbaars Steven
Electrical And Computer Engineering And Materials Departments University Of California
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Nakamura Shuji
Electrical And Computer Engineering Department University Of California
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Iza Michael
Electrical And Computer Engineering And Materials Departments University Of California
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Thompson Daniel
Electrical And Computer Engineering And Materials Departments University Of California
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Brinkley Stuart
Electrical And Computer Engineering Department University Of California
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Iza Michael
Electrical and Computer Engineering, and Materials Departments, University of California, Santa Barbara, CA 93106, U.S.A.
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Mishra Umesh
Electrical & Computer Engineering and Materials Departments, University of California Santa Barbara, CA 93106, U.S.A.
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Mishra Umesh
Electrical and Computer Engineering, and Materials Departments, University of California, Santa Barbara, CA 93106, U.S.A.
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Brinkley Stuart
Electrical and Computer Engineering, and Materials Departments, University of California, Santa Barbara, CA 93106, U.S.A.
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Thompson Daniel
Electrical and Computer Engineering, and Materials Departments, University of California, Santa Barbara, CA 93106, U.S.A.
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Murai Akihiko
Electrical and Computer Engineering, and Materials Departments, University of California, Santa Barbara, CA 93106, U.S.A.
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DenBaars Steven
Electrical & Computer Engineering and Materials Departments, University of California Santa Barbara, CA 93106, U.S.A.
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DenBaars Steven
Electrical and Computer Engineering, and Materials Departments, University of California, Santa Barbara, CA 93106, U.S.A.
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