OS2405 デジタル画像相関法による熱ひずみ計測を用いた次世代三次元積層チップの非線形有限要素解析精度の改善(OS24-2 三次元積層半導体チップにおけるシリコン貫通ビア/微細金属接合技術と強度信頼性,OS-24 三次元積層半導体チップにおけるシリコン貫通ビア/微細金属接合技術と強度信頼性)

概要

論文の詳細を見る
Numerical methods like the fmite element method (FEM) have been used to evaluate the reliability of electronic packages. However, it is difficult to assure the accuracy of numerical analyses of electronic packages, which are nonlinear analyses. In this study, we evaluated the thermal strain of a test chip for 3D (Stacked Integrated Circuits) SIC with both measurement and analyses. First, the distribution of thermal strain on the cross-section of the test chip was measured using the digital image correlation method (DICM). Then, the distribution of strain in the test chip was also analyzed by the FEM with considering the visco-elasticity of underfill resin and the elastic-plasticity of components measured with the nano-indentation. According to the comparison between the DIC measurements and the FEM analyses, we improved the accuracy of the nonlinear fmite element analyses.
一般社団法人日本機械学会の論文
2011-07-16