Modelling of Solid State Bonding Process by Power Law Creep(Physics, Process, Instruments & Measurements)
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概要
- 論文の詳細を見る
The model of solid state bonding based on the finite element method is proposed. It is assumed that the bonding (adhering) process is controlled by viscoplastic (power law creep) deformation. This finite element method can be applied to the large deformation processes, in which the strain rate dependence is taken into account. The numerical results agrees with the experimental ones. We further discuss different models proposed by several researchers, comparing them with the finite element model with respect to the void shrinking rate. It is found that the applicability of the solid state bonding due to power law creep are limited by the degree of bulk deformation (value of strain rate), i.e., the void crushing rate is strikingly affected by the constraint condition of bulk. Therefore, we need to select the models in accordance with the situation of bulk deformation.
- 大阪大学の論文
著者
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Takahashi Y
Osaka University
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INOUE Katsunori
Osaka University
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TAKAHASHI Yasuo
Osaka University
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Nishiguchi Kimiyuki
Faculty of Eng., Osaka University
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KOGUCHI Tsutomu
Osaka University
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Takahashi Y
Osaka Univ. Osaka Jpn
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Inoue K
Osaka Univ. Jpn
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Nishiguchi K
Fuculty Of Eng. Osaka University
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Nishiguchi Kimiyuki
Faculty Of Eng. Osaka Univ.
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Koguchi Tsutomu
Osaka University:(present Office)mitsubishi Heavy Industry
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