TAKAHASHI Yasuo | Osaka University

スポンサーリンク

概要

• TAKAHASHI Yasuoの詳細を見る
• 同名の論文著者
• Osaka Universityの論文著者

関連著者

• INOUE Katsunori

  Osaka University

• TAKAHASHI Yasuo

  Osaka University

• Takahashi Y

  Osaka University

• Inoue K

  Osaka Univ. Jpn

• Takahashi Y

  Osaka Univ. Osaka Jpn

• Nishiguchi K

  Fuculty Of Eng. Osaka University

• Kawaguchi Isao

  Osaka University

• TAKAHASHI Kunio

  Dept. of Mechanical and Intelligent Systems Eng. Tokyo Institute of Technology

• NISHIGUCHI Kimiyuki

  Anan College of Technology

• Nishiguchi Kimiyuki

  Faculty of Eng., Osaka University

• NISHIGUCHI Kimiyuki

  Fuculty of Eng. Osaka University

• MINEMOTO Nobuo

  Osaka University

• KOGUCHI Tsutomu

  Osaka University

• Li Shuguang

  Osaka University:(present Office)capital Aerospace Machinery Corporation

• Takahashi Yasuo

  The Tokyo Metropolitan Research Laboratory Of Public Health:graduate School Of Nutritional And Envir

• Yamane Toshimi

  Fculty Of Eng. Dept Of Mater. Sci. And Eng.

• Miki Koji

  Osaka University

• IMAKITA Tomoyuki

  Kinki University

• IMATANI Akihiro

  Kinki University

• Nishiguchi Kimiyuki

  Faculty Of Eng. Osaka Univ.

• LI Yan

  Osaka University

• NAKAGAWA Koichi

  Komatsu Seisakusho

• Koguchi Tsutomu

  Osaka University:(present Office)mitsubishi Heavy Industry

• Nakagawa K

  Komatsu Seisakusho

• Takahashi K

  Meiji Pharmaceutical University

• Takahashi Yasuo

  Faculty Of Pharmaceutical Sciences Tokyo University Of Science

• Li Yan

  Osaka University:(present Office)shanhai Jiaotong University

• Pang Qiang

  Osaka University

• SADYROV Kalinur

  Kyrghyz Technical Univ.

もっと見る 閉じる

著作論文

• Auger Analysis Across an Interface Between Cr Film and Pure Silica(Physics, Process, Instrument & Measurements)
• Algorithm for Determining Optimum Bonding Condition in Solid State Diffusion Bonding by a Numerical Model(Physics, Process, Instruments & Measurements)
• Modelling of Solid State Bonding Process by Power Law Creep(Physics, Process, Instruments & Measurements)
• Optimization of (Al, Ti) N Thin Film Formation Process by Ion Beam Assisted Deposition(Physics, Processes, Instruments & Measurements)
• Glow Plasma Behaviour in Nitriding Process(Physics, Process, Instruments & Measurements)
• High Temperature Creep of a 20Cr-25Ni Stainless Steel with Carbide Precipitation : Quantitative Analysis of the Precipitates and Theoretical Study of the Steady State Creep(Materials, Metallurgy & Weldability)
• Prediction Algorithm for Solid State Diffusion Bonding in The Case When Material Constants Are Unknown : Surpport System of Optimum Condition of Solid State Joining Process(Physics, Process, Instrument & Measurements)
• A Computational Model for Thin Film Formation during Ion Beam Mixing(Physics, Processes, Instruments & Measurements)
• Peculiarities of the α-Ti and δ(TiN) Layers Formation in Plasma Nitriding of Titanium : Theoretical Estimation of the Critical Temperature for the δ Layer Growth in the Low-Temperature Region(Physics, Processes, Instruments & Measurements)

スポンサーリンク