Algorithm for Determining Optimum Bonding Condition in Solid State Diffusion Bonding by a Numerical Model(Physics, Process, Instruments & Measurements)
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概要
- 論文の詳細を見る
An algorithm to estimate the optimum bonding time is developed by a numerical model, for the purpose of establishing the system of determining the optimum process conditions of the solid state diffusion bonding. The influence of the scattering of surface roughness on the bonding time required to complete the bonding process is mainly examined by the numerical model. The distribution of void spacing in the final stage (bond ratio>95%) is taken into consideration in order to establish the algorithm. It is shown that the plural trials of measuring surface profiles are beneficial to estimate the complete bonding time.
- 大阪大学の論文
著者
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Takahashi Y
Osaka University
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INOUE Katsunori
Osaka University
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TAKAHASHI Yasuo
Osaka University
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NISHIGUCHI Kimiyuki
Fuculty of Eng. Osaka University
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MINEMOTO Nobuo
Osaka University
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Takahashi Y
Osaka Univ. Osaka Jpn
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Inoue K
Osaka Univ. Jpn
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Nishiguchi K
Fuculty Of Eng. Osaka University
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