3107 FOAによる近似最適解のFOAとシームレスに結合する高精度解析技術(OS18 FOAと近似最適化)

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A large feedback loop of the design from thermal detail design to outline design was occurred on high performance mobile terminal design. The cause was that the device layout is decided only by the viewpoint of circuit design on outline design stage. Therefore, the outline thermal layout design method has been needed. For this purpose, we have developed the new high-speed layered design method based on the boundary conditions between modules of our analysis method. This design method is very high-speed (about 300sec), but the accuracy of thermal analysis was still a little poor at critical devices. In this report, we developed the high accuracy analysis method that has the high accuracy approximately equal to FEM analysis with seamless transition from first order analysis. At this time, we focused to the error of the modularized rough model. The reason of the errors is heat flow distribution between modules and inner chip. Then, we solve this problem by making improvements of device module model and analysis method. By using the high accuracy analysis method, the maximum analysis error of the temperature distribution of the device module is improved from about 44% to about 3%. Furthermore at case study, analysis time is about l sec or less and analysis accuracy is less than 2% at temperature distribution of chip. As the result, the high accuracy analysis method has enough accuracy for checking of the electronics device layout design within a short analysis time.
社団法人日本機械学会の論文
2005-08-02

3107 FOAによる近似最適解のFOAとシームレスに結合する高精度解析技術(OS18 FOAと近似最適化)

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