サブミクロン構造体の界面はく離強度に関する破壊力学的検討(S05-2 薄膜界面はく離・欠陥評価,S05 薄膜の強度物性と信頼性)

概要

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Analytical and experimental studies are carried out to evaluate interface strength between submicron structures and substrates on the basis of the fracture mechanics concept. Finite element analyses reveal that the stress intensity near the interface edge between a dot and substrate greatly increases with an increase of the aspect ratio of the dot. Delamination tests for submicron chromium (Cr) dots with different aspect ratios on a silicon dioxide (SiO_2) substrate are conducted by means of a modified AFM. The results show that the smaller load is required to separate the dots with higher aspect ratio from the substrate. This is desirable to evaluate the interface fracture toughness.
一般社団法人日本機械学会の論文
2004-09-04