AFMを用いたシリコン基板とタングステン微小材料の界面強度評価

概要

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An experimental method for evaluating the interface strength of a micro-component on a substrate is developed using a modified Atomic Force Microscopy (AFM). The diamond tip is dragged along the surface of a silicon (Si) substrate with a micro tungsten (W) piece (length: 5 μm, width: 5μm. thickness: 0.1μm), and the lateral as well as the vertical load and displacement are continuously monitored during the test. After the tip hits the W piece, the lateral load, F_1, increases in almost proportion to the lateral displacement, δ_1. The F_1-δ_1 curve exhibits the non-linearity near the peak load, and the piece is abruptly separated from the substrate along the interface. The additional tests, where the load is interrupted before the interface failure, reveal that the non-linearity is attributed to the plastic deformation on the contacted zone. It is also elucidated that the zone is small in comparison with the scale of the W piece. Then, the apparent fracture stress of the interface between W and Si, τ_c, is evaluated as about 58 MPa regardless of the vertical force and the lateral displacement rate.
一般社団法人日本機械学会の論文
2003-08-25