透過型電子顕微鏡を用いたナノスケール構造体中の塑性領域に対するその場観察試験手法の開発

概要

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In order to specify the plasticity of a nanoscale Cu component, we develop a novel experimental method by means of a general purpose transmission electron microscopy (TEM). The characteristic shape of a designed thin specimen, where a Cu film with the thickness of 200nm is sandwiched by rigid materials (Si substrate and SiN layer), enables us to apply a load near Cu/Si interface edge by an indenter, and prevents buckling due to compressive stress. Continuous in-situ TEM images of the Cu film during deformation are successfully obtained, and the generation and expansion of local plastic region of 10nm-30nm are recognized near the Cu/Si interface edge. The yield stress of the plastic region is approximately evaluated to be 200MPa-400MPa, which is close to the one obtained by an inverse analysis under a continuum assumption (345MPa).
2010-12-25