201 Cohesive Zone Modelを用いたCuナノ薄膜/Si基板界面上のき裂発生/伝ぱ基準に関する解析的検討(OS2.接着・接合・界面・薄膜の理論と実験および信頼性評価(1),OS・一般セッション講演)

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Experiments on crack initiation and propagation along the Cu/Si interface in multilayered films (Si/Cu/SiN) with different thicknesses of the Cu layer (20 and 200 nm) have been conducted by using a nano-cantilever and millimeter-sized four-point bend specimens. To examine the applicability of cohesive zone model (CZM) criterion for interfacial delamination along the Cu/Si interface in nanoscale stress concentration, an exponential type of CZM is utilized to simulate the observed delamination processes using the finite element method. After the CZM parameters for the Cu/Si interface are calibrated by an experiment, interface cracking in other experiments is predicted with obtained CZM parameters. This indicates that the CZM criterion is universally applicable for describing cracking along the interface regardless of specimen dimensions and film thickness which include the differences in plastic behavior and residual stress. The CZM criterion can also predict interfacial cracking along Cu/Si interfaces with different stress singularities.
一般社団法人日本機械学会の論文
2011-10-08